AI-assisted RF/Analog IC Design Infrastructure

Automated performance optimization for RF/analog IP development.

SMARTAO turns reusable testbenches, Cadence-oriented simulation, metric extraction, optimization, behavioral/RNM modeling, and report generation into one practical engineering loop.

SpecTargets, constraints, corners, design variables, and architecture candidates.
TestbenchReusable DUT wrappers, stimuli, terminations, node maps, and SKILL schematic hooks.
SimulationSpectre, AMS, PSS/HB/PNoise, transient, PVT, Monte Carlo, and post-processing.
OptimizeMetric-driven search, architecture comparison, model calibration, and write-back.
Reportmetrics.txt, visual figures, datasheets, closure summaries, and reusable models.
Platform

A testbench platform, optimization platform, and modeling platform in one environment.

The current library is organized around reusable RF/analog module classes and customer-owned design instances. In a Cadence-based deployment, the same infrastructure supports circuit-level and system-level test execution, optimization loops, behavioral/RNM modeling, and model-vs-schematic or model-vs-system validation. Developer-provided platform files and customer-generated workspaces are separated so upgrades do not overwrite private projects.

176Formal RF/analog modules
176Modules with tb_main testbenches
1384L3 optimization-ready metrics
66Coarse/fine mapping samples
01

Testbench Automation

Module-aware testbench packages include DUT wrapper contracts, variableized parameters, stimuli, node maps, OCEAN/MDL measurement hooks, and SKILL schematic-generation entry points.

02

Metric-Driven Optimization

Optimization reads normalized metrics.txt outputs, compares candidates, handles PVT/MC validation, and can write optimized variables back into Cadence-oriented collateral.

03

Modeling and Calibration

Behavioral, RNM/EEnet, and coarse/fine model flows support faster exploration, schematic equivalence checks, and reusable model calibration.

04

Complex Stimulus and Postprocess

Registered preprocessors and postprocessors cover supply ripple, jittered clocks, PAM4, modulation, ADC FFT, PLL phase noise, spurs, jitter, RF metrics, and SerDes DSP views.

05

PDK-Aware Deployment

A design intent can own multiple PDK-specific implementations. Each implementation is optimized and validated under its own PDK profile rather than pretending one schematic is portable.

06

Private Expansion

Customers can add private design instances, architectures, and data locally. SMARTAO platform upgrades remain separate from customer-internal IP knowledge.

Coverage

Coverage from leaf circuits to system scenarios.

SMARTAO is not just a module list. It provides repeatable flows for RF/mmWave, power management, data conversion, high-speed IO, clocking, passive/EM, sensors, automotive, wireless, radar, SATCOM, and Bluetooth-style system scenarios.

RF/mmWave
LNAPAMixerPLL/VCO/DCOLO DistributionPhased ArrayRF Front-End
Power
LDOBuck/BoostBattery ChargerPower IntegrityPOR/UVLOPMIC
Data / IO
SAR/DSM/TI ADCPipelined ADCDACSerDesCDRPRBSPAM4
Clocking
PLLADPLLDCODTC/TDCJitterClock TreeReference Conditioner
Passive / EM
InductorTransformerBalunTLineCouplerFilterPackage/Board
Systems
FMCW RadarWiFi/CellularSATCOMBluetoothAutomotiveSensor Readout

Class / Architecture / Instance Separation

Reusable module classes, candidate architectures, and project-specific design instances are stored separately. A 1 V LDO, a 2 V LDO, and several LNA or SerDes front-end architectures can be optimized independently or compared in one candidate run without overwriting each other.

Proof / Demos

Representative output figures generated by the platform.

Normal runs can produce report-ready figures, not only scalar metrics. The examples below are drawn from current SMARTAO demos and show closed-loop coverage across power integrity, data converters, RNM/EEnet model validation, passive RLCK fitting, PLL noise, 112G SerDes, DC-DC conversion, optical PAM4, RF transceiver chains, memory PHY, FMCW radar, and mmWave array systems. Dual-comb/DCS material is intentionally left out of this public page.

Power integrity PDN closure

Power integrity PDN closure

Target-impedance comparison, load-step rail transient, droop, ripple, and decap-driven PDN tradeoffs.

TI ADC mismatch calibration

TI ADC mismatch calibration

Raw versus calibrated spectrum, channel mismatch, interleave spur suppression, and background calibration trace.

RNM/EEnet model validation

RNM/EEnet model validation

Raw model, calibrated model, schematic waveform, residual error, and calibration convergence in one view.

Passive EM-to-RLCK closure

Passive EM-to-RLCK closure

EM-like S-parameters overlaid with fitted RLCK model curves and frequency-dependent fitting error.

PLL long-transient phase noise

PLL long-transient phase noise

PSD, offset phase-noise mask, jitter, reference spur, and fractional-spur extraction from waveform data.

112G PAM4 ADC-based RX chain

112G PAM4 ADC-based RX chain

TX FFE, channel, CTLE, ADC samples, and post-ADC DSP decision variables in one view.

DCDC Buck deep closure

DCDC Buck deep closure

Switching waveform, startup, efficiency map, loop-gain proxy, ripple spectrum, loss breakdown, and thermal closure.

High-speed optical PAM4 link

High-speed optical PAM4 link

PAM4 stimulus, TX FFE, optical modulator/channel, PD/TIA, ADC, RX equalization, and link-quality metrics.

RF transceiver full-chain demo

RF transceiver full-chain

TX/RX impairment budget with DPD, PA nonlinearity, IQ imbalance, LO leakage, phase noise, EVM, ACLR, and calibration closure.

HBM PHY deep demo

HBM PHY deep demo

Wide-I/O memory PHY view with channel response, lane margin, training convergence, PI/thermal stress, bandwidth, and energy closure.

FMCW radar range-Doppler demo

FMCW radar range-Doppler

Chirp scene generation, beat waveform, range profile, range-Doppler map, detection view, and radar metric closure.

mmWave array transceiver demo

mmWave array transceiver

Beamforming, TX/RX link budget, blocker behavior, scan metrics, EVM, sidelobe, and array-calibration style closure.

Use Cases

Where SMARTAO is most valuable first.

The strongest early use cases are blocks where the engineering loop is expensive, testbenches are reusable, and scalar specs do not tell the whole story.

01

Power IP

LDOs, digital LDOs, DC-DC converters, battery paths, UVLO/POR, power integrity, and automotive PMIC scenarios.

02

Clocking and PLL

Integer/fractional PLLs, ADPLL/DCO, VCOs, DTC/TDC, LO distribution, jitter injection, phase-noise and spur workflows.

03

High-Speed IO

112G SerDes, ADC-based receivers, TX FFE, CTLE, FFE/DFE/CDR, MLSE/Viterbi post-processing, and PAM4 stimulus generation.

04

RF/mmWave

LNA, PA, mixers, RF switches, phase shifters, front-end modules, mmWave phased arrays, radar, WiFi/cellular, and SATCOM-oriented tests.

05

Data Conversion

SAR, sigma-delta, time-interleaved, pipelined, hybrid ADCs, DACs, sample-and-hold, code-density and FFT post-processing.

06

Passive / EM

Inductors, transformers, baluns, transmission lines, couplers, filters, RLCK fitting, layout SKILL seeds, and EM-to-circuit closure.

Pilot Program

A practical first engagement.

The first customer-facing step should be a focused pilot around one real circuit block, one existing Cadence testbench, or one high-value system scenario that needs reusable testing, optimization, and modeling.

Week 1

Week 1

Select one block, define specs, review the existing Cadence testbench, and bind nodes/variables.

Week 2

Week 2

Connect metrics, preprocess/postprocess profiles, and initial optimization variables.

Weeks 3-4

Weeks 3-4

Run candidate optimization, PVT/MC validation, visual reports, and model-calibration experiments.

Closeout

Closeout

Deliver a reusable flow package, results review, next-block plan, and licensing path.

Customer IP boundary

Customer designs, PDK paths, simulation data, and learned project knowledge remain in the customer workspace by default. Platform upgrades and customer private instances are deliberately separated.

SMARTAO

SMART = intelligence, efficiency, automation. TAO = method, engineering path, tools, and discipline. The brand stands for practical automation that guides complex semiconductor design toward verifiable and reusable results.

Insights

Technical articles to build market awareness.

Short posts can turn SMARTAO from a private tool into a visible technical point of view without exposing source code or customer IP.

Why analog IP optimization needs reusable testbench infrastructure

Analog optimization is usually limited by how repeatable the measurement loop is, not by the optimizer itself.

Analog IP optimization is not limited by the optimizer. It is usually limited by how repeatable the measurement loop is.

For many analog and RF blocks, the real engineering effort sits in the testbench: biasing the DUT correctly, applying realistic stimuli, defining corners, extracting meaningful metrics, and making sure every candidate is evaluated in the same way. Without reusable testbench infrastructure, every optimization run becomes a fragile one-off experiment.

A good reusable testbench standardizes the interface between design variables, simulation setup, and measured results. The optimizer should not need to understand every schematic detail. It should see a clean parameter set and a consistent metrics file.

It also captures engineering judgment. The right load transient for an LDO, the right two-tone setup for an LNA, the right jitter and channel condition for a SerDes receiver, or the right FFT window for an ADC are all part of the design knowledge. Reusable testbenches preserve that knowledge.

Most importantly, reusable testbenches make results comparable. Architecture A, architecture B, different PDK corners, and later design revisions can all be evaluated through the same measurement contract. That is what turns optimization from trying many simulations into a disciplined design flow.

What 112G SerDes optimization needs beyond a single eye diagram

A single eye diagram can show whether one case looks open, but it cannot explain where the link margin came from.

An eye diagram is useful, but for 112G SerDes it is not enough.

At 112G PAM4, the link is a chain of tightly coupled impairments: TX FFE tap settings, package and channel loss, CTLE peaking, ADC resolution, clock jitter, CDR behavior, FFE/DFE adaptation, and sometimes MLSE or other sequence detection. A clean-looking eye at one point in the chain may not tell you why the link works, where the margin comes from, or what will fail across corners.

A stronger optimization flow needs stage-aware metrics. Before the receiver, we need channel insertion loss, return loss, crosstalk, and TX pre-emphasis. Inside the receiver, we need CTLE response, ADC input range, quantization noise, timing margin, and equalizer convergence. After detection, we need SER or BER estimates, error distribution, jitter tolerance, and adaptation stability.

It also needs realistic stimuli. PAM4 symbols, PRBS patterns, jitter injection, bandwidth-limited channels, and stressed channel conditions reveal problems that a simple waveform snapshot can hide.

A single eye diagram answers, does this case look open? A serious 112G SerDes optimization flow answers why it is open, how much margin exists, and which knobs actually created that margin.

How RF/analog teams can use AI without giving away design IP

AI can assist the workflow while schematics, PDK data, layouts, and proprietary waveforms remain inside the company environment.

RF and analog teams can benefit from AI without exposing schematics, PDK data, or proprietary design details.

The key is to keep AI close to the workflow, but far from confidential implementation data. Instead of sending full schematics or layouts to an external model, teams can expose structured, limited information: block type, target specs, allowed variables, simulation status, metric names, and anonymized failure modes.

AI is especially useful around the design loop. It can help generate test plans, suggest likely measurements, organize optimization variables, explain failed simulations, compare candidate results, and draft reports. These tasks need engineering context, but not the full circuit.

A safe architecture separates three layers: a private layer for schematics, PDK files, simulation waveforms, extracted views, and customer-specific IP; a structured interface layer for sanitized specs, corners, variable ranges, metric outputs, logs, and workflow states; and an automation layer that applies approved actions locally.

For RF/analog design, the most practical use of AI may not be generating a complete circuit. It may be helping engineers run better experiments, reuse knowledge, diagnose issues faster, and turn simulation data into decisions while keeping the real IP safely inside the design environment.

Contact

Build RF/analog IP faster, with more reusable engineering evidence.

SMARTAO is suitable for pilot evaluations, internal IP development, design automation partnerships, and investor/customer discussions around RF/analog IC automation.

SMARTAO

Founder: Yusheng (Boris) Chen

RF/Analog and mixed-signal IC designer building AI-assisted automation infrastructure for reusable testbenches, simulation-driven optimization, behavioral modeling, and system-level validation.

info@smartao.ai

+1 669 294 3892

www.smartao.ai

RF/Analog IP Automation · Simulation · Optimization · Modeling